Invention Grant
- Patent Title: Transfer mold body
- Patent Title (中): 转移模具体
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Application No.: US13868400Application Date: 2013-04-23
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Publication No.: US08722177B2Publication Date: 2014-05-13
- Inventor: Kenichi Sugisaka , Takashi Ichikawa , Eiji Yamada , Atsushi Tsukihara , Ryusuke Sadamatsu , Katsuyuki Imaeda , Soichiro Ogawa
- Applicant: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Applicant Address: JP Aichi-Ken
- Assignee: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Current Assignee: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Current Assignee Address: JP Aichi-Ken
- Agency: Roberts Mlotkowski Safran & Cole P.C.
- Priority: JP2012-099958 20120425
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
In a transfer mold body, a display portion is formed from a crystalline resin and a main body portion is formed from an amorphous resin. Accordingly, a transfer layer is only transferred to the amorphous resin formed main body portion that has good transfer properties for the transfer layer, and the transfer layer is not transferred to the crystalline resin formed display portion that has poor transfer properties for the transfer layer. Accordingly, only the main body portion is decorated by the transfer layer, with the display portion to which the transfer layer is not transferred visibly displayed as the letter. Accordingly, since printing process is not necessary, suppressing an increase in cost of the transfer mold body. Moreover, the position of the letter is determined by two-color molding of the main body portion and the display portion, enabling positional displacement of the letter to be suppressed.
Public/Granted literature
- US20130288020A1 TRANSFER MOLD BODY Public/Granted day:2013-10-31
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