Invention Grant
- Patent Title: Resin composition and multilayer structure using the same
- Patent Title (中): 树脂组合物和使用其的多层结构
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Application No.: US12866743Application Date: 2009-04-10
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Publication No.: US08722181B2Publication Date: 2014-05-13
- Inventor: Shinji Okamoto , Kouji Yamada
- Applicant: Shinji Okamoto , Kouji Yamada
- Applicant Address: JP Osaka
- Assignee: The Nippon Synthetic Chemical Industry Co., Ltd.
- Current Assignee: The Nippon Synthetic Chemical Industry Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2008-104408 20080414; JP2008-107727 20080417
- International Application: PCT/JP2009/057403 WO 20090410
- International Announcement: WO2009/128411 WO 20091022
- Main IPC: C08L29/04
- IPC: C08L29/04

Abstract:
The present invention provides a resin composition of a saponified ethylene-vinyl ester copolymer can provide a molded product including layer of the resin composition with less thickness variation and excellent gas-barrier properties, even if the layer is subjected to stretch forming such as deep drawing forming and vacuum-pressure forming where the layer is applied with different tension from side to side thereof in short time. The resin composition comprises an EVOH resin having ethylene content of 20 to 60 mol % and a PVA having 1,2-diol structural unit in a side chain. The present invention also provides a multilayer structure using the resin composition.
Public/Granted literature
- US20110020626A1 RESIN COMPOSITION AND MULTILAYER STRUCTURE USING THE SAME Public/Granted day:2011-01-27
Information query
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