Invention Grant
- Patent Title: Intermediate layer material and composite laminate
- Patent Title (中): 中间层材料和复合层压板
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Application No.: US12281242Application Date: 2007-02-27
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Publication No.: US08722191B2Publication Date: 2014-05-13
- Inventor: Hideki Kitano , Haruyuki Hatano
- Applicant: Hideki Kitano , Haruyuki Hatano
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2006-058537 20060303
- International Application: PCT/JP2007/000139 WO 20070227
- International Announcement: WO2007/099710 WO 20070907
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B5/14 ; C08G59/40 ; H05K1/03

Abstract:
There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (α1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.
Public/Granted literature
- US20090017308A1 INTERMEDIATE LAYER MATERIAL AND COMPOSITE LAMINATE Public/Granted day:2009-01-15
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