Invention Grant
- Patent Title: Radiation-sensitive resin composition
- Patent Title (中): 辐射敏感树脂组合物
-
Application No.: US12602769Application Date: 2008-05-26
-
Publication No.: US08722306B2Publication Date: 2014-05-13
- Inventor: Hirokazu Sakakibara , Makoto Shimizu , Takehiko Naruoka , Tomoki Nagai , Yoshifumi Oizumi
- Applicant: Hirokazu Sakakibara , Makoto Shimizu , Takehiko Naruoka , Tomoki Nagai , Yoshifumi Oizumi
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2007-149717 20070605
- International Application: PCT/JP2008/059625 WO 20080526
- International Announcement: WO2008/149701 WO 20081211
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/028 ; G03F7/039

Abstract:
A radiation-sensitive resin composition includes a resin (A1) that includes a repeating unit shown by the following formula (1-1) and a repeating unit shown by the following formula (1-2), and a radiation-sensitive acid generator (B). The radiation-sensitive resin composition exhibits excellent sensitivity, and can reduce a mask error factor (MEEF). wherein R1, R2, and R3 individually represent a linear or branched alkyl group having 1 to 4 carbon atoms, R4 represents a hydrogen atom, a linear or branched alkyl group having 2 to 4 carbon atoms, a linear or branched fluoroalkyl group having 1 to 4 carbon atoms, or a linear or branched alkoxy group having 1 to 4 carbon atoms, and q represents an integer from 0 to 3.
Public/Granted literature
- US20100178608A1 RADIATION-SENSITIVE RESIN COMPOSITION Public/Granted day:2010-07-15
Information query
IPC分类: