Invention Grant
US08722433B2 Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
有权
用波长转换层制造发光二极管（LED）晶片的方法
- Patent Title: Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
- Patent Title (中): 用波长转换层制造发光二极管（LED）晶片的方法
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Application No.: US13902881Application Date: 2013-05-27
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Publication No.: US08722433B2Publication Date: 2014-05-13
- Inventor: Jui-Kang Yen
- Applicant: SemiLEDS Optoelectronics Co., Ltd.
- Applicant Address: TW Chu-Nan
- Assignee: SemiLEDS Optoelectronics Co., Ltd.
- Current Assignee: SemiLEDS Optoelectronics Co., Ltd.
- Current Assignee Address: TW Chu-Nan
- Agent Stephen A. Gratton
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/50
Abstract:
A method for fabricating light emitting diode (LED) dice includes the steps of mixing wavelength conversion particles in a base material to a first weight percentage, mixing reflective particles in the base material to a second weight percentage, curing the base material to form a wavelength conversion layer having a selected thickness, and attaching the wavelength conversion layer to a die.
Public/Granted literature
- US20130260494A1 METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS Public/Granted day:2013-10-03
Information query
IPC分类:
