Invention Grant
US08722454B2 Method for manufacturing organic electronic component having salt compound
有权
制造具有盐化合物的有机电子部件的方法
- Patent Title: Method for manufacturing organic electronic component having salt compound
- Patent Title (中): 制造具有盐化合物的有机电子部件的方法
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Application No.: US13668451Application Date: 2012-11-05
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Publication No.: US08722454B2Publication Date: 2014-05-13
- Inventor: Hsin-Fei Meng , Hao-Wu Lin , Sheng-Fu Horng , Hsiao-Wen Zan , Hao-Wen Chang , Yu-Fan Chang , Yu-Chian Chiu
- Applicant: Hsin-Fei Meng , Hao-Wu Lin , Sheng-Fu Horng , Hsiao-Wen Zan , Hao-Wen Chang , Yu-Fan Chang , Yu-Chian Chiu
- Applicant Address: TW Hsinchu
- Assignee: National Chiao Tung University
- Current Assignee: National Chiao Tung University
- Current Assignee Address: TW Hsinchu
- Agency: Hershikovitz & Associates, PLLC
- Agent Abe Hershkovitz
- Priority: TW101128684A 20120808
- Main IPC: H01L51/40
- IPC: H01L51/40
Abstract:
A method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer.
Public/Granted literature
- US20140045298A1 METHOD FOR MANUFACTURING ORGANIC ELECTRONIC COMPONENT HAVING SLAT COMPOUND Public/Granted day:2014-02-13
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