Invention Grant
US08722486B2 Enhancing deposition uniformity of a channel semiconductor alloy by forming a recess prior to the well implantation
有权
通过在阱注入之前形成凹槽来提高通道半导体合金的沉积均匀性
- Patent Title: Enhancing deposition uniformity of a channel semiconductor alloy by forming a recess prior to the well implantation
- Patent Title (中): 通过在阱注入之前形成凹槽来提高通道半导体合金的沉积均匀性
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Application No.: US12908053Application Date: 2010-10-20
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Publication No.: US08722486B2Publication Date: 2014-05-13
- Inventor: Stephan Kronholz , Maciej Wiatr , Roman Boschke , Peter Javorka
- Applicant: Stephan Kronholz , Maciej Wiatr , Roman Boschke , Peter Javorka
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Priority: DE102009055394 20091230
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
When forming sophisticated gate electrode structures requiring a threshold adjusting semiconductor alloy for one type of transistor, a recess is formed in the corresponding active region, thereby providing superior process uniformity during the deposition of the semiconductor material. Moreover, the well dopant species is implanted after the recessing, thereby avoiding undue dopant loss. Due to the recess, any exposed sidewall surface areas of the active region may be avoided during the selective epitaxial growth process, thereby significantly contributing to enhanced threshold stability of the resulting transistor including the high-k metal gate stack.
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