Invention Grant
- Patent Title: Method for forming identification marks on silicon carbide single crystal substrate, and silicon carbide single crystal substrate
- Patent Title (中): 在碳化硅单晶衬底上形成识别标记的方法和碳化硅单晶衬底
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Application No.: US13817907Application Date: 2012-01-05
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Publication No.: US08722507B2Publication Date: 2014-05-13
- Inventor: Sadahiko Kondo
- Applicant: Sadahiko Kondo
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Keating & Bennett, LLP
- Priority: JP2011-001235 20110106
- International Application: PCT/JP2012/050080 WO 20120105
- International Announcement: WO2012/093684 WO 20120712
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A method for forming an identification mark on a silicon carbide single crystal substrate according to the present invention includes: (a) scanning a principal surface of a silicon carbide single crystal substrate with a laser beam at a first energy density such that a groove is formed in the principal surface of the silicon carbide single crystal substrate, thereby forming an identification mark which is constituted of one or more grooves in the principal surface of the silicon carbide single crystal substrate; and (b) scanning an inside of the groove formed in the principal surface of the silicon carbide single crystal substrate with a laser beam at a second energy density that is lower than the first energy density.
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