Multi-tiered semiconductor devices and associated methods

Invention Grant

US08722525B2 Multi-tiered semiconductor devices and associated methods 有权

Title translation: 多层半导体器件及相关方法

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Patent Title: Multi-tiered semiconductor devices and associated methods
Patent Title (中): 多层半导体器件及相关方法
Application No.: US13165546

Application Date: 2011-06-21
Publication No.: US08722525B2

Publication Date: 2014-05-13
Inventor: Nishant Sinha
Applicant: Nishant Sinha
Applicant Address: US ID Boise
Assignee: Micron Technology, Inc.
Current Assignee: Micron Technology, Inc.
Current Assignee Address: US ID Boise
Agency: Schwegman, Lundberg & Woessner, P.A.
Main IPC: H01L21/84
IPC: H01L21/84 ; H01L21/311 ; H01L27/06

Multi-tiered semiconductor devices and associated methods

Abstract:

Methods of fabricating multi-tiered semiconductor devices are described, along with apparatus and systems that include them. In one such method, a first dielectric is formed, and a second dielectric is formed in contact with the first dielectric. A channel is formed through the first dielectric and the second dielectric with a first etch chemistry, a void is formed in the first dielectric with a second etch chemistry, and a device is formed at least partially in the void in the first dielectric. Additional embodiments are also described.

Abstract(Chinese):

描述制造多层半导体器件的方法以及包括它们的装置和系统。在一种这样的方法中，形成第一电介质，并且形成与第一电介质接触的第二电介质。通过第一电介质和第二电介质通过第一蚀刻化学品形成通道，在第一电介质中用第二蚀刻化学物质形成空隙，并且器件至少部分地形成在第一电介质的空隙中。还描述了另外的实施例。

Public/Granted literature

US20120326221A1 MULTI-TIERED SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS Public/Granted day:2012-12-27

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/84	.....衬底不是半导体的，例如绝缘体