Invention Grant
- Patent Title: Biodegradable resin composition
- Patent Title (中): 生物降解树脂组合物
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Application No.: US13055327Application Date: 2009-07-21
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Publication No.: US08722774B2Publication Date: 2014-05-13
- Inventor: Taiki Yoshino , Akira Takenaka , Keiko Fukaya
- Applicant: Taiki Yoshino , Akira Takenaka , Keiko Fukaya
- Applicant Address: JP Tokyo
- Assignee: Kao Corporation
- Current Assignee: Kao Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-188703 20080722; JP2009-103026 20090421
- International Application: PCT/JP2009/063318 WO 20090721
- International Announcement: WO2010/010961 WO 20100128
- Main IPC: C08G18/38
- IPC: C08G18/38 ; C08L1/00
Abstract:
A biodegradable resin composition containing a biodegradable resin and a cellulose having a crystallinity of less than 50%; and a biodegradable resin molded article wherein the biodegradable resin composition as defined above is molded. The biodegradable resin composition can be suitably used for various industrial applications, such as daily sundries, household electric appliance parts, and automobile parts.
Public/Granted literature
- US20110130488A1 BIODEGRADABLE RESIN COMPOSITION Public/Granted day:2011-06-02
Information query
