Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US13813903Application Date: 2011-08-18
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Publication No.: US08722813B2Publication Date: 2014-05-13
- Inventor: Hiroki Sawada , Masahiro Mori
- Applicant: Hiroki Sawada , Masahiro Mori
- Applicant Address: JP Tokyo
- Assignee: Kao Corporation
- Current Assignee: Kao Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-183944 20100819
- International Application: PCT/JP2011/068703 WO 20110818
- International Announcement: WO2012/023589 WO 20120223
- Main IPC: C08F283/00
- IPC: C08F283/00 ; C08G63/91

Abstract:
A resin composition containing: an ester compound including a carboxylic acid ester obtained by using (1) a monohydric alcohol having an alkyl group having 1 to 4 carbon atoms; (2) a dicarboxylic acid having an alkylene group having 2 to 4 carbon atoms; and (3) a dihydric alcohol having an alkylene group having 2 to 6 carbon atoms, the ester compound having an acid value of 1.00 mgKOH/g or less, a hydroxyl value of 5.0 mgKOH/g or less, and a number-average molecular weight of from 300 to 700; and an aliphatic polyester. Since the resin composition of the present invention inhibits the generation of volatile compounds, the resin composition can be suitably used in various industrial applications, such as daily sundries, household electric appliance parts, and automobile parts.
Public/Granted literature
- US20130137802A1 RESIN COMPOSITION Public/Granted day:2013-05-30
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