Methods, systems, and apparatuses are provided for three-dimensional coiling via structures. A substrate includes a plurality of insulating layers, a plurality of trace layers interleaved with the insulating layers, and a three-dimensional coiling via. The three-dimensional coiling via includes a plurality of electrically conductive traces and a plurality of electrically conductive vias through the insulating layers. The electrically conductive traces are present in at least two of the traces layers and are coupled together by the electrically conductive vias. The electrically conductive traces are arranged to form at least one partial turn around an axis through the substrate.