Invention Grant
- Patent Title: Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies
- Patent Title (中): 用于优化层压复合组件上的电互连的方法和装置
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Application No.: US13778415Application Date: 2013-02-27
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Publication No.: US08723052B1Publication Date: 2014-05-13
- Inventor: Brian Sullivan , Stephane Eisen
- Applicant: Boulder Wind Power, Inc.
- Applicant Address: US CO Louisville
- Assignee: Boulder Wind Power, Inc.
- Current Assignee: Boulder Wind Power, Inc.
- Current Assignee Address: US CO Louisville
- Agency: Cooley LLP
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
In some embodiments, a system includes a conductor on a first layer of a laminated composite assembly. The laminated composite assembly has an input, an output, a first electrical interconnect which couples the conductor on the first layer of the laminated composite assembly with a second conductor on a second layer of the laminated composite assembly, and a second electrical interconnect which electrically couples the first conductor with the second conductor. A width of the second electrical interconnect is greater than a width of the first electrical interconnect. A resistance of the laminated composite assembly as measured between the electrical input and the electrical output is less than the resistance of the laminated composite assembly as measured between the electrical input and the electrical output if the width of the first electrical interconnect were substantially equal to the width of the second electrical interconnect.
Information query