Invention Grant
US08723076B2 On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
有权
实时控制光斑尺寸和切割速度,实时控制激光操作中的沟槽深度和宽度
- Patent Title: On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
- Patent Title (中): 实时控制光斑尺寸和切割速度,实时控制激光操作中的沟槽深度和宽度
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Application No.: US13399856Application Date: 2012-02-17
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Publication No.: US08723076B2Publication Date: 2014-05-13
- Inventor: Mehmet E. Alpay , Brian Johansen , David Childers
- Applicant: Mehmet E. Alpay , Brian Johansen , David Childers
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Stoel Rives LLP
- Main IPC: B23K26/08
- IPC: B23K26/08 ; H01L39/24

Abstract:
Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
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