Invention Grant
US08723280B2 Hybrid MEMS bump design to prevent in-process and in-use stiction
有权
混合MEMS凸块设计，以防止在进程和使用中的粘滞
- Patent Title: Hybrid MEMS bump design to prevent in-process and in-use stiction
- Patent Title (中): 混合MEMS凸块设计，以防止在进程和使用中的粘滞
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Application No.: US13563935Application Date: 2012-08-01
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Publication No.: US08723280B2Publication Date: 2014-05-13
- Inventor: Chia-Pao Shu , Wen-Chuan Tai , Chia-Ming Hung , Hsiang-Fu Chen
- Applicant: Chia-Pao Shu , Wen-Chuan Tai , Chia-Ming Hung , Hsiang-Fu Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L29/82
- IPC: H01L29/82
Abstract:
A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.
Public/Granted literature
- US20140035072A1 HYBRID MEMS BUMP DESIGN TO PREVENT IN-PROCESS AND IN-USE STICTION Public/Granted day:2014-02-06
Information query
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