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US08723288B2 Method of cutting single crystals 有权
单晶切割方法

Method of cutting single crystals
Abstract:
A single crystal having a technologically generated cleavage surface that extends along a natural crystallographic cleavage plane with an accuracy of less than |0.001°| when measured over a length relevant for the technology of the single crystal or over each of a plurality of surface areas extending in the direction of separation and having a length ≧2 mm within the technologically relevant surface area.
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