Invention Grant
- Patent Title: Electrical fuse device
- Patent Title (中): 电熔丝装置
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Application No.: US13471508Application Date: 2012-05-15
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Publication No.: US08723290B2Publication Date: 2014-05-13
- Inventor: Dong-suk Shin , Andrew-Tae Kim , Hong-jae Shin
- Applicant: Dong-suk Shin , Andrew-Tae Kim , Hong-jae Shin
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2007-0089078 20070903
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L27/112

Abstract:
The invention relates generally to a fuse device of a semiconductor device, and more particularly, to an electrical fuse device of a semiconductor device. Embodiments of the invention provide a fuse device that is capable of reducing programming error caused by non-uniform current densities in a fuse link. In one respect, there is provided an electrical fuse device that includes: an anode; a fuse link coupled to the anode on a first side of the fuse link; a cathode coupled to the fuse link on a second side of the fuse link; a first cathode contact coupled to the cathode; and a first anode contact coupled to the anode, at least one of the first cathode contact and the first anode contact being disposed across a virtual extending surface of the fuse link.
Public/Granted literature
- US20120223802A1 ELECTRICAL FUSE DEVICE Public/Granted day:2012-09-06
Information query
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