Invention Grant
- Patent Title: Semiconductor device, manufacturing method thereof, electronic device and vehicle
- Patent Title (中): 半导体装置及其制造方法,电子装置和车辆
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Application No.: US13488282Application Date: 2012-06-04
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Publication No.: US08723295B2Publication Date: 2014-05-13
- Inventor: Yuki Fukui , Hiroaki Katou
- Applicant: Yuki Fukui , Hiroaki Katou
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn, IP Law Group, PLLC
- Priority: JP2011-126537 20110606
- Main IPC: H01L27/082
- IPC: H01L27/082

Abstract:
The present invention makes it possible to inhibit an SOA (Safe Operating Area) in a vertical-type bipolar transistor from narrowing. A p-type base layer 150 includes a first peak, a second peak, and a third peak in an impurity profile in the thickness direction. The first peak is located on the topmost surface side of a semiconductor substrate 100. The second peak is located closer to the bottom face side of the semiconductor substrate 100 than the first peak and higher than the first peak. The third peak is located between the first peak and the second peak.
Public/Granted literature
- US20120307508A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE AND VEHICLE Public/Granted day:2012-12-06
Information query
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