Invention Grant
- Patent Title: Saw filter having planar barrier layer and method of making
- Patent Title (中): 具有平面阻挡层的锯片和制造方法
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Application No.: US13183977Application Date: 2011-07-15
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Publication No.: US08723392B2Publication Date: 2014-05-13
- Inventor: James W. Adkisson , Panglijen Candra , Thomas J. Dunbar , Jeffrey P. Gambino , Mark D. Jaffe , Anthony K. Stamper , Randy L. Wolf
- Applicant: James W. Adkisson , Panglijen Candra , Thomas J. Dunbar , Jeffrey P. Gambino , Mark D. Jaffe , Anthony K. Stamper , Randy L. Wolf
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Richard M. Kotulak
- Main IPC: H03H9/25
- IPC: H03H9/25
Abstract:
Disclosed herein is a surface acoustic wave (SAW) filter and method of making the same. The SAW filter includes a piezoelectric substrate; a planar barrier layer disposed above the piezoelectric substrate, and at least one conductor buried in the piezoelectric substrate and the planar barrier layer.
Public/Granted literature
- US20130015744A1 SAW FILTER HAVING PLANAR BARRIER LAYER AND METHOD OF MAKING Public/Granted day:2013-01-17
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