Invention Grant
- Patent Title: Surface acoustic wave device, electronic apparatus, and sensor apparatus
- Patent Title (中): 声表面波装置,电子仪器和传感器装置
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Application No.: US13223581Application Date: 2011-09-01
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Publication No.: US08723396B2Publication Date: 2014-05-13
- Inventor: Kunihito Yamanaka , Takuya Owaki , Naohisa Obata
- Applicant: Kunihito Yamanaka , Takuya Owaki , Naohisa Obata
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2010-201750 20100909
- Main IPC: H03H9/25
- IPC: H03H9/25

Abstract:
A SAW device has an IDT which is provided on the principal surface of a quartz crystal sustrate having Euler angles (−1.5°≦φ≦1.5°, 117°≦θ≦142°, ψ) and excites a SAW in a stopband upper end mode. Inter-electrode-finger grooves 8 are recessed between the electrode fingers of the IDT. When the Euler angle ψ is 42.79°≦|ψ|≦49.57°, the thickness H of the electrode fingers of the IDT is set to be within 0.055 μm≦H≦0.335 μm, preferably, 0.080 μm≦H≦0.335 μm. When the Euler angle ψ is |ψ|≠90°×n (where n=0, 1, 2, 3), and the thickness H of the electrode fingers is set to 0.05 μm≦H≦0.20 μm.
Public/Granted literature
- US20120062070A1 SURFACE ACOUSTIC WAVE DEVICE, ELECTRONIC APPARATUS, AND SENSOR APPARATUS Public/Granted day:2012-03-15
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