Invention Grant
- Patent Title: Inspection apparatus, substrate mounting device and inspection method
- Patent Title (中): 检查装置,基板安装装置及检查方法
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Application No.: US13580473Application Date: 2011-01-14
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Publication No.: US08723536B2Publication Date: 2014-05-13
- Inventor: Yusuke Miyazaki , Kenji Aiko , Yuichiro Iijima , Yuichiro Kato
- Applicant: Yusuke Miyazaki , Kenji Aiko , Yuichiro Iijima , Yuichiro Kato
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2010-080071 20100331
- International Application: PCT/JP2011/000161 WO 20110114
- International Announcement: WO2011/121868 WO 20111006
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
Non-contact type displacement sensors which measure the height of a substrate surface are installed above the substrate in order to hold the upper surface of the substrate at a desired height or to maintain the flatness of the substrate. A substrate mounting device is such that a plurality of grooves and of barriers are provided on the upper surface of a table and air is supplied between the substrate and the table to enable the pressure of air to displace the substrate. In addition, the substrate mounting device has such a structure as to make it possible to deform the substrate into an arbitrary convex-concave shape or to make the substrate flat by feeding back the output of the displacement sensor.
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