Invention Grant
- Patent Title: Vertical micro contact probe having variable stiffness structure
- Patent Title (中): 具有可变刚度结构的垂直微接触探针
-
Application No.: US12991492Application Date: 2009-04-30
-
Publication No.: US08723541B2Publication Date: 2014-05-13
- Inventor: Jung-Yup Kim , Hak-Joo Lee , Kyung-Shik Kim
- Applicant: Jung-Yup Kim , Hak-Joo Lee , Kyung-Shik Kim
- Applicant Address: KR Daejeon
- Assignee: Korea Institute of Machinery & Materials
- Current Assignee: Korea Institute of Machinery & Materials
- Current Assignee Address: KR Daejeon
- Agency: Latzer Baratz LLP
- Agent Pearl Cohen Zedek
- Priority: KR10-2008-0042931 20080508
- International Application: PCT/KR2009/002309 WO 20090430
- International Announcement: WO2009/136707 WO 20091112
- Main IPC: G01R1/067
- IPC: G01R1/067

Abstract:
An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression.
Public/Granted literature
- US20110057675A1 PERPENDICULAR FINE-CONTACT PROBE HAVING A VARIABLE-STIFFNESS STRUCTURE Public/Granted day:2011-03-10
Information query