Invention Grant
- Patent Title: Three-dimensional shape measuring apparatus, integrated circuit, and three-dimensional shape measuring method
- Patent Title (中): 三维形状测量装置,集成电路和三维形状测量方法
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Application No.: US12677373Application Date: 2009-07-10
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Publication No.: US08723928B2Publication Date: 2014-05-13
- Inventor: Takaaki Moriyama , Akira Uesaki , Tadashi Yoshida , Yudai Ishibashi
- Applicant: Takaaki Moriyama , Akira Uesaki , Tadashi Yoshida , Yudai Ishibashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-181540 20080711
- International Application: PCT/JP2009/003238 WO 20090710
- International Announcement: WO2010/004763 WO 20100114
- Main IPC: H04N7/18
- IPC: H04N7/18 ; H04N13/04

Abstract:
It is possible to perform three-dimensional shape measurement with easy processing, regardless of whether an object is moving or not. An image capturing unit (103) captures a captured image (I) including both a real image (I2) of the object (113R) and a mirror (101). A light amount changing unit (63a) changes a light amount of a virtual image (I1). An image separating unit (captured image separating unit 104) specifies, as a virtual image (Ib1), an image in a region having a different light amount (R1), in a captured image (Ia) in which the light amount is changed and a captured image (Ib) in which the light amount is not changed, and specifies an image in a region having the same light amount (R2) as a real image (Ib2). A three dimensional shape is reconstructed from the real image and so on that are specified.
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