Invention Grant
- Patent Title: Hinge assembly
- Patent Title (中): 铰链总成
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Application No.: US13233383Application Date: 2011-09-15
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Publication No.: US08724306B2Publication Date: 2014-05-13
- Inventor: Britt C Ashcraft , Peter M On , Michael Delpier
- Applicant: Britt C Ashcraft , Peter M On , Michael Delpier
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
Example embodiments disclosed herein relate to a hinge assembly. An example of the hinge assembly includes a pair of active hinges and a pair of passive hinges. The hinge assembly may be utilized in portable computing devices such as notebook computers and personal digital assistants (PDAs).
Public/Granted literature
- US20130070406A1 HINGE ASSEMBLY Public/Granted day:2013-03-21
Information query
