Invention Grant
US08724342B2 Shield with resilient spring snaps for removable attachment to an electrical circuit board without the use of adhesive or solder
有权
带有弹性弹簧卡扣的防护罩，可拆卸地连接到电路板上，无需使用粘合剂或焊料
- Patent Title: Shield with resilient spring snaps for removable attachment to an electrical circuit board without the use of adhesive or solder
- Patent Title (中): 带有弹性弹簧卡扣的防护罩，可拆卸地连接到电路板上，无需使用粘合剂或焊料
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Application No.: US13426311Application Date: 2012-03-21
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Publication No.: US08724342B2Publication Date: 2014-05-13
- Inventor: Lucas G. Schrab
- Applicant: Lucas G. Schrab
- Applicant Address: US MI Zeeland
- Assignee: Gentex Corporation
- Current Assignee: Gentex Corporation
- Current Assignee Address: US MI Zeeland
- Agency: Price Heneveld LLP
- Agent Scott P. Ryan
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02
Abstract:
A cover shield for a circuit board having a body. A peripheral wall is disposed about an edge of the body. First and second slots each include a first portion that extends through the body and a second portion that extends through the peripheral wall. A barbed tab is disposed between the first and second slots. A notch extends through a portion of the barbed tab. A distinct abutting member is disposed on the peripheral wall.
Public/Granted literature
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