Invention Grant
- Patent Title: Sentiment cube
- Patent Title (中): 情感立方体
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Application No.: US13017013Application Date: 2011-01-30
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Publication No.: US08725781B2Publication Date: 2014-05-13
- Inventor: Umeshwar Dayal , Maria G Castellanos , Chetan Kumar Gupta , Song Wang , Meichun Hsu
- Applicant: Umeshwar Dayal , Maria G Castellanos , Chetan Kumar Gupta , Song Wang , Meichun Hsu
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06F17/30
- IPC: G06F17/30

Abstract:
A sentiment cube system is disclosed. In one example, the system discloses a sentiment storage, including a sentiment cube data structure having a set of cells arranged by a set of dimensions. The system includes a computer programmed with executable instructions which operate a set of modules, wherein the modules comprise: a sentiment storage module which receives sentiment values associated with a set of entity features, and then populates a hierarchy of the cells in the sentiment cube with the sentiment values. A sentiment analysis module effecting a set of operations on the sentiment cube.
Public/Granted literature
- US20120197950A1 SENTIMENT CUBE Public/Granted day:2012-08-02
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