Invention Grant
- Patent Title: High throughput LDPC decoder
- Patent Title (中): 高吞吐量LDPC解码器
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Application No.: US13463774Application Date: 2012-05-03
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Publication No.: US08726122B2Publication Date: 2014-05-13
- Inventor: Eran Pisek
- Applicant: Eran Pisek
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Main IPC: H03M13/00
- IPC: H03M13/00

Abstract:
According to one embodiment, a wireless communications device includes a low-density parity check (LDPC) decoder configured to receive a codeword associated with a parity check H-matrix. The LDPC decoder includes multiple processing elements coupled to a memory for storing the parity check H-matrix comprising R rows and C columns. Each processing element is configured to perform LDPC decoding on different rows of the H-matrix during multiple sub-iterations. A first portion of the processing elements are configured to process certain rows in an upward direction in the H-matrix relative to other rows and a second portion of the processing elements are configured to process other certain rows in a downward direction in the H-matrix relative to the other rows.
Public/Granted literature
- US20120290892A1 HIGH THROUGHPUT LDPC DECODER Public/Granted day:2012-11-15
Information query
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