Invention Grant
- Patent Title: Configurable logic integrated circuit having a multidimensional structure of configurable elements
- Patent Title (中): 具有可配置元件的多维结构的可配置逻辑集成电路
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Application No.: US12720898Application Date: 2010-03-10
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Publication No.: US08726250B2Publication Date: 2014-05-13
- Inventor: Martin Vorbach , Armin Nückel
- Applicant: Martin Vorbach , Armin Nückel
- Applicant Address: DE Munich
- Assignee: Pact XPP Technologies AG
- Current Assignee: Pact XPP Technologies AG
- Current Assignee Address: DE Munich
- Agent Edward P. Heller, III
- Priority: DE19926538 19990610; DE10000423 20000109; DE10018119 20000412
- Main IPC: G06F9/45
- IPC: G06F9/45 ; G06F9/44

Abstract:
Programming of modules which can be reprogrammed during operation is described. Partitioning of code sequences is also described.
Public/Granted literature
- US20100228918A1 CONFIGURABLE LOGIC INTEGRATED CIRCUIT HAVING A MULTIDIMENSIONAL STRUCTURE OF CONFIGURABLE ELEMENTS Public/Granted day:2010-09-09
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