Invention Grant
- Patent Title: Housing for electronic device and method for making the same
- Patent Title (中): 电子设备外壳及其制造方法
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Application No.: US13089417Application Date: 2011-04-19
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Publication No.: US08726485B2Publication Date: 2014-05-20
- Inventor: Zhu-Sha Weng , Yong-Gang Zhu
- Applicant: Zhu-Sha Weng , Yong-Gang Zhu
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110066155 20110318
- Main IPC: B21B1/46
- IPC: B21B1/46 ; B21B13/22 ; B22D11/126 ; B22D11/128 ; B23P17/00 ; B23P25/00
Abstract:
A housing for an electronic device includes a base and a pattern layer formed on the base. The pattern layer includes a blasting area and peripheral area, the blasting area has rough surface formed by sandblasting, the blasting area is a pattern section and has a width of at least 70 micrometer; the peripheral area has a slippery surface a peripheral section of the pattern section. The disclosure also described a method to make the housing.
Public/Granted literature
- US20120234574A1 HOUSING FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-09-20
Information query
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