A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.