Invention Grant
- Patent Title: Method and system of cooling components of a computer system
- Patent Title (中): 计算机系统冷却组件的方法和系统
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Application No.: US11625956Application Date: 2007-01-23
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Publication No.: US08726681B2Publication Date: 2014-05-20
- Inventor: Don P. Williams
- Applicant: Don P. Williams
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: F25D23/12
- IPC: F25D23/12

Abstract:
A method and system of cooling components of a computer system. At least some of the illustrative embodiments are computer systems comprising an enclosure, a motherboard within the enclosure, a heat generating component coupled to the motherboard and within the enclosure, a canister comprising a compressed fluid (the canister coupled to the enclosure), and a gas cooling device selectively fluidly coupled to the compressed fluid (the gas cooling device produces chilled gas when fluidly coupled to the compressed fluid). The chilled gas is directed upon the heat generating component.
Public/Granted literature
- US20080173036A1 METHOD AND SYSTEM OF COOLING COMPONENTS OF A COMPUTER SYSTEM Public/Granted day:2008-07-24
Information query
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