Invention Grant
- Patent Title: Fluid ejecting apparatus
- Patent Title (中): 流体喷射装置
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Application No.: US12776542Application Date: 2010-05-10
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Publication No.: US08727491B2Publication Date: 2014-05-20
- Inventor: Eiichiro Watanabe
- Applicant: Eiichiro Watanabe
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2009-114701 20090511
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A fluid ejecting apparatus includes a fluid ejecting head that has a nozzle formation surface and ejects fluid from a nozzle formed as a hole through the nozzle formation surface. A fluid catching unit has an opening that faces the nozzle formation surface of the fluid ejecting head at the time of flushing, as waste fluid is ejected from the nozzle of the fluid ejecting head. The fluid catching unit receives the waste fluid ejected from the nozzle through the opening. A cover mechanism includes a cover member that moves between cover retracted positions. At the cover position, the cover member can close the opening of the fluid catching unit. At the retracted position, the cover member cannot close the opening during the flushing. Negative pressure is generated inside the fluid catching unit when the cover member is positioned at the cover position.
Public/Granted literature
- US20100283815A1 FLUID EJECTING APPARATUS Public/Granted day:2010-11-11
Information query
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