Invention Grant
- Patent Title: Protecting a fluid ejection device resistor
- Patent Title (中): 保护流体喷射装置电阻
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Application No.: US13332797Application Date: 2011-12-21
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Publication No.: US08727499B2Publication Date: 2014-05-20
- Inventor: Roberto A. Pugliese, Jr. , Timothy R. Emery , Ed Friesen , Rio Rivas
- Applicant: Roberto A. Pugliese, Jr. , Timothy R. Emery , Ed Friesen , Rio Rivas
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Nathan R. Rieth
- Main IPC: B41J2/05
- IPC: B41J2/05 ; H01L21/02 ; G01D15/00 ; G11B5/127
Abstract:
In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate.
Public/Granted literature
- US20130162724A1 PROTECTING A FLUID EJECTION DEVICE RESISTOR Public/Granted day:2013-06-27
Information query
IPC分类:
