Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US13508703Application Date: 2012-03-19
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Publication No.: US08727562B2Publication Date: 2014-05-20
- Inventor: Gang Yu
- Applicant: Gang Yu
- Applicant Address: CN Shenzhen, Guangdong Province
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province
- Agent Cheng-Ju Chiang
- International Application: PCT/CN2012/072506 WO 20120319
- International Announcement: WO2013/120298 WO 20130822
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
The present invention provides a backlight module, which includes a backboard, a light bar mounted on the backboard, and a thermo-sensitive heat conduction material interposed between the backboard and the light bar. The thermo-sensitive heat conduction material functions to automatically adjust thermal conductivity coefficient with variation of temperature so that different portions of the light bar have different thermal conductivity coefficients in order to control the temperature of the whole light bar in a predetermined range to ensure desired performance of thermal conduction and further ensuring temperature uniformity of the whole backlight module and preventing the occurrence of luminance lowering of the whole backlight module due to excessive local high temperature.
Public/Granted literature
- US20130208503A1 Backlight Module Public/Granted day:2013-08-15
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