Invention Grant
- Patent Title: Optical module assembled on circuit board via holder
- Patent Title (中): 光模块通过支架组装在电路板上
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Application No.: US13547900Application Date: 2012-07-12
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Publication No.: US08727639B2Publication Date: 2014-05-20
- Inventor: Takashi Matsui , Hiromi Kurashima
- Applicant: Takashi Matsui , Hiromi Kurashima
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori
- Priority: JP2011-160208 20110721
- Main IPC: G02B6/36
- IPC: G02B6/36
Abstract:
An optical transceiver having an optical subassembly electrically connected to a circuit board with an RF connector is disclosed. The optical transceiver further provides a holder for support the RF connector. The circuit board is held by a leg and an arm each being provided in the holder, and putting the circuit board therebetween.
Public/Granted literature
- US20130022360A1 OPTICAL MODULE ASSEMBLED ON CIRCUIT BOARD VIA HOLDER Public/Granted day:2013-01-24
Information query
