Invention Grant
US08727701B2 Modular fan housing with multiple modular units having sound attenuation for a fan array for an air-handling system 有权
具有多个模块化单元的模块化风扇外壳具有用于空气处理系统的风扇阵列的声音衰减

  • Patent Title: Modular fan housing with multiple modular units having sound attenuation for a fan array for an air-handling system
  • Patent Title (中): 具有多个模块化单元的模块化风扇外壳具有用于空气处理系统的风扇阵列的声音衰减
  • Application No.: US13856174
    Application Date: 2013-04-03
  • Publication No.: US08727701B2
    Publication Date: 2014-05-20
  • Inventor: Lawrence G Hopkins
  • Applicant: Huntair, Inc.
  • Applicant Address: US OR Tualatin
  • Assignee: Huntair, Inc.
  • Current Assignee: Huntair, Inc.
  • Current Assignee Address: US OR Tualatin
  • Agency: The Small Patent Law Group LLC
  • Agent Dean Small
  • Main IPC: F04D25/08
  • IPC: F04D25/08
Modular fan housing with multiple modular units having sound attenuation for a fan array for an air-handling system
Abstract:
A modular fan housing configured to hold an array of motors and fans is provided. The modular fan housing is configured for use in an air-handling system that delivers air to a ventilation system for at least a portion of a building. The fan housing comprises a plurality of modular units configured to be stacked adjacent to one another in at least one row or column to form an array. The modular units each include an interior surface and have a front end and a back end that define a chamber. The chambers are configured to receive the motors and fans. Sound attenuation layers extend along at least a portion of the interior surface of the corresponding chambers. The sound attenuation layers are positioned between at least some of the adjacent chambers.
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