Invention Grant
- Patent Title: Serial fan module and frame structure thereof
- Patent Title (中): 串行风扇模块及其框架结构
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Application No.: US12109922Application Date: 2008-04-25
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Publication No.: US08727717B2Publication Date: 2014-05-20
- Inventor: Chia-Ming Hsu , Shun-Chen Chang
- Applicant: Chia-Ming Hsu , Shun-Chen Chang
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW96132412A 20070831
- Main IPC: F04D29/54
- IPC: F04D29/54

Abstract:
A serial fan module includes a first fan, a second fan and a plurality of guide elements. The first fan has a first frame body and a first impeller disposed within the first frame body. The second fan has a second frame body and a second impeller disposed within the second frame body. The guide elements are disposed between the first impeller and the second impeller, wherein the guide elements guide airflow from the first fan to the second fan. Each of the guide elements has an axial extended part and an inclined part and the inclined part meets the axial extended part at a camber angle. Each of the inclined part has an inner edge toward the first impeller and each of the axial extended part has an outer edge toward the second impeller.
Public/Granted literature
- US20090060732A1 SERIAL FAN MODULE AND FRAME STRUCTURE THEREOF Public/Granted day:2009-03-05
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