Invention Grant
- Patent Title: Die plate for resin granulation
- Patent Title (中): 模板用于树脂造粒
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Application No.: US13525749Application Date: 2012-06-18
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Publication No.: US08727762B2Publication Date: 2014-05-20
- Inventor: Tetsuo Makida , Kenji Nishimoto , Osamu Sumida , Tomonori Hashimoto
- Applicant: Tetsuo Makida , Kenji Nishimoto , Osamu Sumida , Tomonori Hashimoto
- Applicant Address: JP Tokyo
- Assignee: The Japan Steel Works, Ltd.
- Current Assignee: The Japan Steel Works, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, LLP
- Priority: JP2011-136344 20110620
- Main IPC: B29C47/86
- IPC: B29C47/86

Abstract:
In order to ensure quality of pellets by eliminating temperature differences among extrusion nozzle holes with use of a heating medium flowing through heating channels only once and flowing out through a heating medium outlet, provided is a die plate for resin granulation, in which a plate main body (1) is divided into regions (A to n) for every 360/n (n=4, 6, or 8) degrees, or into first to fourth regions (A to D) for every 90 degrees, and an inner annular heating passage (4) and an outer annular heating passage (5) are formed. A heating medium (F) supplied through a heating medium inlet (2) flows through heating channels (8) only once, and then flows out through a heating medium outlet (3) to an outside.
Public/Granted literature
- US20120321737A1 DIE PLATE FOR RESIN GRANULATION Public/Granted day:2012-12-20
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