A connector which is capable of preventing spring characteristics of contacts from changing due to sucking up of solder. A plurality of contacts each include a contact portion in contact with an electrode of a card-type electronic component, a spring portion for pressing the contact portion against the electrode of the card-type electronic component, and a connection portion which is soldered to a pad on a printed substrate. The spring portion of each contact is formed with a low wettability area on an end thereof toward the connection portion, to which solder is less likely to adhere.