Invention Grant
- Patent Title: Manufacturing method for three-dimensional GaN epitaxial structure
- Patent Title (中): 三维GaN外延结构的制造方法
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Application No.: US12568291Application Date: 2009-09-28
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Publication No.: US08728235B2Publication Date: 2014-05-20
- Inventor: I-Kai Lo , Chia-Ho Hsieh , Yu-Chi Hsu , Wen-Yuan Pang , Ming-Chi Chou
- Applicant: I-Kai Lo , Chia-Ho Hsieh , Yu-Chi Hsu , Wen-Yuan Pang , Ming-Chi Chou
- Applicant Address: TW Kaohsiung
- Assignee: National Sun Yat-Sen University
- Current Assignee: National Sun Yat-Sen University
- Current Assignee Address: TW Kaohsiung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW098107912A 20090311
- Main IPC: C30B25/18
- IPC: C30B25/18

Abstract:
A manufacturing method for three-dimensional GaN epitaxial structure comprises a disposing step, in which a substrate of LiAlO2 and a source metal of Ga are disposed inside an vacuum chamber. An exposing step is importing N ions in plasma state and generated by a nitrogen source into the chamber. A heating step is heating up the source metal to generate Ga vapor. A growing step is forming a three-dimensional GaN epitaxial structure with hexagonal micropyramid or hexagonal rod having a broadened disk-like surface on the substrate by reaction between the Ga vapor and the plasma state of N ions.
Public/Granted literature
- US20100229788A1 THREE-DIMENSIONAL GAN EPITAXIAL STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-09-16
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