Invention Grant
US08728236B2 Low dislocation density III-V nitride substrate including filled pits and process for making the same
有权
低位错密度III-V氮化物衬底包括填充凹坑及其制造方法
- Patent Title: Low dislocation density III-V nitride substrate including filled pits and process for making the same
- Patent Title (中): 低位错密度III-V氮化物衬底包括填充凹坑及其制造方法
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Application No.: US13008008Application Date: 2011-01-17
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Publication No.: US08728236B2Publication Date: 2014-05-20
- Inventor: Xueping Xu , Robert P. Vaudo
- Applicant: Xueping Xu , Robert P. Vaudo
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Agent Vincent K. Gustafson
- Main IPC: C30B25/02
- IPC: C30B25/02

Abstract:
Large area single crystal III-V nitride material having an area of at least 2 cm2, having a uniformly low dislocation density not exceeding 3×106 dislocations per cm2 of growth surface area, and including a plurality of distinct regions having elevated impurity concentration, wherein each distinct region has at least one dimension greater than 50 microns, is disclosed. Such material can be formed on a substrate by a process including (i) a first phase of growing the III-V nitride material on the substrate under pitted growth conditions, e.g., forming pits over at least 50% of the growth surface of the III-V nitride material, wherein the pit density on the growth surface is at least 102 pits/cm2 of the growth surface, and (ii) a second phase of growing the III-V nitride material under pit-filling conditions.
Public/Granted literature
- US20110140122A1 LARGE AREA, UNIFORMLY LOW DISLOCATION DENSITY GaN SUBSTRATE AND PROCESS FOR MAKING THE SAME Public/Granted day:2011-06-16
Information query
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