Invention Grant
- Patent Title: Sensor assembly
- Patent Title (中): 传感器组件
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Application No.: US12081997Application Date: 2008-04-24
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Publication No.: US08728288B2Publication Date: 2014-05-20
- Inventor: Flemming Aas , Erik Helleso Nicolajsen
- Applicant: Flemming Aas , Erik Helleso Nicolajsen
- Applicant Address: DK
- Assignee: Radiometer Medical Aps
- Current Assignee: Radiometer Medical Aps
- Current Assignee Address: DK
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: EP07388028 20070427
- Main IPC: G01N27/00
- IPC: G01N27/00 ; B01L3/00

Abstract:
The invention relates to a sensor assembly comprising a first electronic wiring substrate having a first and a second surface and at least one analyte sensor formed on the first surface thereof, the at least one analyte sensor being connected with one or more electrical contact points, a second electronic wiring substrate having a first and a second surface and at least one analyte sensor formed on the first surface part thereof, the at least one analyte sensor being connected with one or more electrical contact points, and a spacer having a through-going recess with a first and a second opening, wherein the first substrate, the second substrate and the spacer are arranged in a layered structure, where the first surface of the first substrate closes the first opening of the spacer and the first surface of the second substrate closes the second opening of the spacer, thereby forming a measuring cell which is faced by at least one sensor from each of the substrates.
Public/Granted literature
- US20090060789A1 Sensor assembly Public/Granted day:2009-03-05
Information query