Invention Grant
- Patent Title: Method for patterning polymer surface
- Patent Title (中): 图案聚合物表面的方法
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Application No.: US12576666Application Date: 2009-10-09
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Publication No.: US08728584B2Publication Date: 2014-05-20
- Inventor: Shu-Chen Hsieh
- Applicant: Shu-Chen Hsieh
- Applicant Address: TW Kaohsiung
- Assignee: National Sun Yat-Sen University
- Current Assignee: National Sun Yat-Sen University
- Current Assignee Address: TW Kaohsiung
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW98107521A 20090309
- Main IPC: H05H1/00
- IPC: H05H1/00 ; C03C15/00 ; C03C25/68
Abstract:
The invention provides a method for patterning a polymer surface. A polymer layer is formed on a substrate. A conductive grid with a mesh pattern is placed on the polymer layer. The mesh pattern is transferred to the polymer layer by a plasma treatment. The conductive grid is then removed.
Public/Granted literature
- US20100227079A1 METHOD FOR PATTERNING POLYMER SURFACE Public/Granted day:2010-09-09
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