Invention Grant
US08728706B2 Radiation-sensitive resin composition, method for forming resist pattern, polymer and polymerizable compound
有权
辐射敏感树脂组合物，抗蚀剂图案形成方法，聚合物和可聚合化合物
- Patent Title: Radiation-sensitive resin composition, method for forming resist pattern, polymer and polymerizable compound
- Patent Title (中): 辐射敏感树脂组合物，抗蚀剂图案形成方法，聚合物和可聚合化合物
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Application No.: US13420618Application Date: 2012-03-15
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Publication No.: US08728706B2Publication Date: 2014-05-20
- Inventor: Yuusuke Asano , Mitsuo Satou , Hiromitsu Nakashima , Kazuki Kasahara , Yoshifumi Oizumi , Masafumi Hori , Takanori Kawakami , Yasuhiko Matsuda , Kazuo Nakahara
- Applicant: Yuusuke Asano , Mitsuo Satou , Hiromitsu Nakashima , Kazuki Kasahara , Yoshifumi Oizumi , Masafumi Hori , Takanori Kawakami , Yasuhiko Matsuda , Kazuo Nakahara
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2009-218175 20090918; JP2009-235763 20091009; JP2010-080744 20100331
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30
Abstract:
A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR′—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R′ represents a hydrogen atom or an alkali-labile group, and “#” and “##” indicates a bonding hand bonded to R1. -A-R1 (x)
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