Invention Grant
US08728714B2 Methods for adhering materials, for enhancing adhesion between materials, and for patterning materials, and related semiconductor device structures
有权
用于粘合材料的方法，用于增强材料之间的粘附性和用于图案化材料的方法以及相关的半导体器件结构
- Patent Title: Methods for adhering materials, for enhancing adhesion between materials, and for patterning materials, and related semiconductor device structures
- Patent Title (中): 用于粘合材料的方法，用于增强材料之间的粘附性和用于图案化材料的方法以及相关的半导体器件结构
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Application No.: US13298889Application Date: 2011-11-17
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Publication No.: US08728714B2Publication Date: 2014-05-20
- Inventor: Dan B. Millward
- Applicant: Dan B. Millward
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: G01N33/557
- IPC: G01N33/557
Abstract:
Methods for adhering materials and methods for enhancing adhesion between materials are disclosed. In some embodiments, a polymer brush material is bonded to a base material, and a developable polymer resist material is applied over the grafted polymer brush material. The resist material is at least partially miscible in the grafted polymer brush material. As such, the resist material at least partially dissolves within the grafted polymer brush material to form an intertwined material of grafted polymer brush macromolecules and resist polymer macromolecules. Adhesion between the developable polymer resist and the base material may be thereby enhanced. Also disclosed are related semiconductor device structures.
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