Invention Grant
US08728716B2 Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern
有权
树脂图案，图案的制造方法，MEMS结构的制造方法，半导体装置的制造方法以及制造电镀图案的方法
- Patent Title: Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern
- Patent Title (中): 树脂图案，图案的制造方法，MEMS结构的制造方法，半导体装置的制造方法以及制造电镀图案的方法
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Application No.: US13416870Application Date: 2012-03-09
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Publication No.: US08728716B2Publication Date: 2014-05-20
- Inventor: Takeshi Andou , Junichi Fujimori , Hiroyuki Yonezawa , Yasumasa Kawabe , Hideyuki Nakamura
- Applicant: Takeshi Andou , Junichi Fujimori , Hiroyuki Yonezawa , Yasumasa Kawabe , Hideyuki Nakamura
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-054358 20110311; JP2011-102973 20110502
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
There is provided that a method for producing a resin pattern, and the method includes at least the steps (1) to (7) in this order; (1) a coating step of coating a photosensitive resin composition on a substrate; (2) a solvent removal step of removing the solvent from the applied photosensitive resin composition; (3) an exposure step of patternwise exposing the photosensitive resin composition from which the solvent has been removed, to an active radiation; (4) a development step of developing the exposed photosensitive resin composition using an aqueous developer liquid; (5) an overcoating step of providing an overcoat layer on the developed photosensitive resin composition; (6) a heat-treating step of heat-treating the photosensitive resin composition on which the overcoat layer has been provided; and (7) a removal step of removing the overcoat layer.
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