Invention Grant
US08728841B2 Method of manufacturing ESD resistant nitride semiconductor light emitting device with enhanced light extraction efficiency
有权
制造具有增强的光提取效率的耐ESD氮化物半导体发光器件的方法
- Patent Title: Method of manufacturing ESD resistant nitride semiconductor light emitting device with enhanced light extraction efficiency
- Patent Title (中): 制造具有增强的光提取效率的耐ESD氮化物半导体发光器件的方法
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Application No.: US13365056Application Date: 2012-02-02
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Publication No.: US08728841B2Publication Date: 2014-05-20
- Inventor: Jeong Tak Oh , Yong Chun Kim
- Applicant: Jeong Tak Oh , Yong Chun Kim
- Applicant Address: KR Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0132442 20081223
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A nitride semiconductor light emitting device, and a method of manufacturing the same are disclosed. The nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer disposed on the substrate and including a plurality of V-shaped pits in a top surface thereof, an active layer disposed on the n-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits, and a p-type nitride semiconductor layer disposed on the active layer and including a plurality of protrusions on a top surface thereof. Since the plurality of V-shaped pits are formed in the top surface of the n-type nitride semiconductor layer, the protrusions can be formed on the p-type nitride semiconductor layer as an in-situ process. Accordingly, the resistance to ESD, and light extraction efficiency are enhanced.
Public/Granted literature
- US20120129289A1 NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-05-24
Information query
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