Invention Grant
US08728844B1 Backside CMOS compatible bioFET with no plasma induced damage
有权
背面CMOS兼容的bioFET,没有等离子体引起的损坏
- Patent Title: Backside CMOS compatible bioFET with no plasma induced damage
- Patent Title (中): 背面CMOS兼容的bioFET,没有等离子体引起的损坏
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Application No.: US13706002Application Date: 2012-12-05
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Publication No.: US08728844B1Publication Date: 2014-05-20
- Inventor: Yi-Shao Liu , Chun-Ren Cheng , Ching-Ray Chen , Yi-Hsien Chang , Fei-Lung Lai , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
Public/Granted literature
- US20140151755A1 BACKSIDE CMOS COMPATIBLE BIOFET WITH NO PLASMA INDUCED DAMAGE Public/Granted day:2014-06-05
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