Invention Grant
- Patent Title: Solution processing method for forming electrical contacts of organic devices
- Patent Title (中): 用于形成有机器件电触点的溶液处理方法
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Application No.: US13106665Application Date: 2011-05-12
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Publication No.: US08728848B2Publication Date: 2014-05-20
- Inventor: Claudio Girotto
- Applicant: Claudio Girotto
- Applicant Address: BE Leuven BE Leuven
- Assignee: IMEC,Katholieke Universiteit Leuven R&D
- Current Assignee: IMEC,Katholieke Universiteit Leuven R&D
- Current Assignee Address: BE Leuven BE Leuven
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L51/00

Abstract:
A method for forming, on an organic semiconductor layer, an electrical contact layer comprising a metal, is disclosed. In one aspect, the method includes providing a charge collecting barrier layer on the organic semiconductor layer, providing a liquid composition comprising a precursor for the metal on the charge collecting barrier layer, and performing a sintering process. The charge collecting barrier layer is substantially impermeable to the components of the liquid composition.
Public/Granted literature
- US20110308598A1 SOLUTION PROCESSING METHOD FOR FORMING ELECTRICAL CONTACTS OF ORGANIC DEVICES Public/Granted day:2011-12-22
Information query
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