Invention Grant
- Patent Title: Method of processing a semiconductor assembly
- Patent Title (中): 半导体组件的处理方法
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Application No.: US13630231Application Date: 2012-09-28
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Publication No.: US08728855B2Publication Date: 2014-05-20
- Inventor: Bastiaan Arie Korevaar , Faisal Razi Ahmad
- Applicant: First Solar, Inc
- Applicant Address: US AZ Tempe
- Assignee: First Solar, Inc.
- Current Assignee: First Solar, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: MacMillan, Sobanski & Todd, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for processing a semiconductor assembly is presented. The method includes: (a) contacting at least a portion of a semiconductor assembly with a chalcogen source, wherein the semiconductor assembly comprises a semiconductor layer comprising a semiconductor material disposed on a support; (b) introducing a chalcogen from the chalcogen source into at least a portion of the semiconductor material; and (c) disposing a window layer on the semiconductor layer after the step (b).
Public/Granted literature
- US20140094025A1 METHOD OF PROCESSING A SEMICONDUCTOR ASSEMBLY Public/Granted day:2014-04-03
Information query
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